ZB-S800 High-Precision 3D SPI Solder Paste Inspection Machine | Automated SMT Printing Quality Control System

Advanced 3D Solder Paste Inspection for Accurate Volume, Height, and Offset Measurement – Improve Yield and Reduce Defects

The 3D SPI Solder Paste Inspection Machine ZB-S800 is an advanced inline inspection system designed to accurately measure solder paste volume, height, and position on PCBs. Using Phase Measuring Profilometry(PMP) imaging technology and high-resolution cameras, it helps you identify and eliminate printing defects early by inspecting the solder paste printing results before component placement. This prevents the costly waste of PCBs andcomponents, reduces rework rates, and dramatically improves overall First Pass Yield (FPY). And it supports data traceability for intelligent SMT manufacturing. It is an indispensable tool for modern, high-reliability electronics production.

• Al-Driven Intelligence
  Advanced Al software algorithms ensureultra-high detection accuracy and stabilityminimizing false calls and escaping.
• True 3D Measurement Accuracy
  Utilizes Phase Measuring Profilometry(PMP) imaging technology for precise 3Dmeasurement of solder paste, not just 2D imaging.
• Fast Inline Detection 
  Real-time inspection speed up to 0.34 sec/FOV, ensuring no bottleneck in SMT lines.
• Superior optical SystemCombination of high-resolution 
  Industrial camera and telecentnic lens capturesHigh-definition images without parallax,resists reflection interference, and solvesdepth-of-field issues.
• 100% In-Line Integration
  Designed for seamless integration into anySMT production line, enabling real-timeinspection and process control withoutslowing down production.
• Smart SPC Analysis
  Automatic statistical process control to detect trends and prevent print drift.
• Full Traceability & Reporting
  Generate detailed inspection reports for quality tracking and audits.

For more details, pls check the brochure.