Professional BGA/SMT Rework System with 3 Heating Zones, HD Vision Alignment, Touchscreen Control – Ideal for PCB Repair and Chip Reballing

Take your PCB repair precision to the next level with the ZB-RS1 BGA Rework Station, a high-performance infrared and hot air rework system engineered for professional electronics repair, reballing, and SMD/BGA chip replacement. Equipped with triple-zone heating, optical alignment, and a powerful 5300W thermal system, this workstation ensures stable, repeatable results across a wide range of board and chip sizes.

The ZB-RS1 features a high-resolution CCD camera with split-vision alignment, a 7-inch touchscreen controller, and supports automated soldering profiles with ±3°C precision. Whether you're working on laptops, gaming consoles, smartphones, or industrial PCBs, this machine delivers unmatched accuracy and efficiency.

Built for high-demand environments such as SMT workshops, electronics repair labs, and OEM/ODM prototyping teams, it’s your go-to solution for advanced rework and chip-level repair.

• Triple Heating Zones: Top hot air, bottom hot air, and lower IR heating with independent PID control
• High Power Output: Total power of up to 5300W for fast and stable heat transfer 
• HD Optical Alignment System: Dual CCD cameras with ±0.02mm precision and LED illumination
• Large PCB Compatibility: Supports boards up to 412 × 370 mm and BGA chips from 2 × 2 to 60 × 60 mm
• Touch Screen Control: 7" touch interface with visual UI, programmable temperature curves, and over 20,000 profile storage slots
• Intelligent Temperature Management: ±3°C accuracy with real-time monitoring and multi-stage temperature zones
• Safe & Reliable: Emergency stop, overheat protection, and adjustable pressure vacuum pick-up nozzle
• Ideal For: Laptop motherboard repair, smartphone chip rework, automotive ECU BGA replacement, game console SMD reballing

For more details, pls check brochure or contact rose@itechsmt.com

Model No.: ZB-RS1
Power Supply: AC 220V±10%, 50/60Hz, 5300W
Heater Power: Top heater 1400W, Bottom heater 1200W, IR heater 2700W
PCB support: PCB size: Max. 412*370mm, Min. 6*6mm
BGA chip size: Max. 60*60mm, Min 2*2mm
IR Temp. Zone Size: 285*375mm
Sensors: 1pc
Operation Method: 7'' HD touch screen
Control System: Automatic heating control system V2
Display System: 15'' SD industrial display (720P front screen)
Alignment System: 2M pixels SD digital imaging system, automatic optical zoom with laser red-dot indicator
Vacuum Absorption: Automatic
Alignment Accuracy: ±0.02mm
Temp.Control: K-type thermocouple closed-loop control with accuracy up to ±3℃
Positioning: V-groove with universal fixture
Machine Size: L685*W633*H850mm
Net Weight: 76KGS
Gross Weight: 110KGS
Packing Dimension: 80*80*110cm

BGA Rework Station ZB-RS1 Product Brochure