Reflow Oven VS Hot Plate, Which use?

Reflow Oven VS Hot Plate, Which use?

If your needs are to balance between small batch production, laboratory R&D or maintenance, then the desktop small reflow oven and the heating plate have their own advantages and disadvantages, depending on your specific needs. Let's compare them in detail:

✅ Desktop small reflow oven Application: Suitable for small batch SMT patch soldering. Suitable for R&D, laboratory, small production needs. Requires a relatively stable and uniform temperature curve. 

🔹 Advantages:

✔Automated soldering, controllable temperature curve, reducing problems such as false soldering and cold soldering. 

✔Suitable for high-density devices such as BGA, QFN, QFP, etc., to ensure soldering quality. 

✔Good stability, suitable for batch soldering, no manual operation required. 

🔻 Disadvantages:

❌The price is higher than the heating plate, generally in the hundreds of USD dollars level (depending on the brand and function). 

❌The volume is relatively large and occupies a certain space.

❌The preheating time is long, and it may take several minutes to enter the appropriate temperature curve.

✅ Heating Plate Application: Suitable for repair, secondary rework, or small-scale manual soldering. Suitable for DIP plug-in soldering and preheating circuit boards. Suitable for BGA rework or soldering with a hot air gun. 

🔹 Advantages:

✔ Low cost, generally available for one hundred USD dollars (depending on the brand and size)

✔ Flexible operation, can be used alone or with hot air guns, soldering irons and other tools.

✔ Suitable for repair, more convenient for desoldering and rework. 

🔻 Disadvantages:

❌ Manual operation is required, soldering consistency is low, and it is easily affected by human factors. 

❌ Poor temperature uniformity, some poor soldering may occur.

❌ Not suitable for BGA rework (unless used with a hot air gun). 

Conclusion: If you mainly do small-batch SMT soldering and pursue stable and automated soldering, choose a desktop reflow oven. If your needs are to repair, solder a small amount of PCBs, or rework BGA/QFN, it is more appropriate to choose a heating plate (with a hot air gun). 

👉 Is your specific need for mass production, maintenance, or R&D? I can help you recommend a specific equipment model.