3 ZONES 1000MM INFRARED IC HEATERS REFLOW SOLDERING MACHINE

This is a micro-processor controlled reflow oven, works automatically by micro-computer control. It can satisfy a dissimilarity SMD, BGA soldering a request on a PCB assembly. Adoption fast infrared radiation, the temperature is very accurate and even. The small reflow oven has 1000mm lengthy tunnel with a conveyor belt that transports PCBs. RF-B330C reflow oven include 3 separately heated zones that may be individually temperature adjusted. PCBs are treated at a regulated rate (Conveyor speed adjustable) as they pass through the oven and each zone. This conveyorised reflow oven is very good for PCB prototyping and small SMT production line.

• PID Digital Temperature Control System
• High temperature Lead Free Soldering applications up to 400°C
• Infrared IC Heaters
• Stainless steel conveyor
• 1000mm Long Heat Tunnel
• Upper 3 Heating Zones 
• 300mm wide conveyor
• Easy lift clamshell design
• High-Efficiency and Energy-Saving Heating Tube

Model: RF-B330C

Heating Zone: Upper 3 Heating Zones

Heating Method: Infrared

Cooling Zone: 2 Natural Air Cooling

Heat Tunnel length: 1000mm

Mesh Width: 300mm

PCB Width Allowance: Max. 280mm

PCB Height Allowance: ≤20mm (Customize Acceptable)

Mesh Height: 300±20mm

Conveyor Speed: 0-1350mm/min

Conveyor Direction: Left→Right (Right→Left)

Preheat Time: 15-20mins

Soldering Time: 3.5-5.5mins

Temperature Range: 0°C-400°C

Temperature Control: PID Digital Temperature Control System

Voltage: AC 220V/AC 380V, 50Hz

Starting Power: 6KW

Working Power: 2KW

Net Weight: 131gs

Gross Weight: 210kgs

Machine Size: L1700×W710×H660mm

Package Dimension: 1840*840*800mm